Prime Minister Datuk Seri Anwar Ibrahim announced that Malaysia plans to attract RM500 billion in investments for integrated circuit (IC) design, advanced packaging, and manufacturing equipment for semiconductor chips.
Under the National Semiconductor Strategy (NSS), launched in April, the government aims to establish at least 10 Malaysian companies in design and advanced packaging, each generating between RM1 billion and RM4.7 billion in revenue, according to The Star.
The Prime Minister also outlined a target to establish around 100 semiconductor-related companies with a combined revenue of RM1 billion to boost higher wages for Malaysians.
Additionally, the NSS will develop Malaysia into a global research and development (R&D) hub for semiconductors, incorporating world-class universities, corporate R&D centres, and centres of excellence that integrate Malaysian and international talent.
We will also develop Malaysia as a global R&D hub for semiconductors, featuring world-class universities, corporate R&D and centres of excellence, blending the very best of Malaysian and international talent. The NSS will also train and upskill 60,000 Malaysian engineers.
Prime Minister, Datuk Seri Anwar Ibrahim
The government plans to allocate at least RM25 billion in fiscal support to implement the NSS, with targeted incentives to be detailed by the Investment, Trade, and Industry Ministry soon. Anwar emphasised that these initiatives are crucial for Malaysia to achieve its goal of becoming a global chip hub.
The NSS is structured in three phases: building on foundations, advancing to the frontier, and innovating at the frontier. Anwar stated that the NSS will remain adaptable, evolving as needed, while steadfastly pursuing the aspiration to make Malaysia a significant global player in accessible technology through its semiconductor industry.
